Application |
CPU: |
Intel LGA775 Core 2 Duo up to 3.6GHz for 1U Server |
Specification |
Overall Dimension:
Weight: |
92 x 90 x 26.5 mm
590g |
RoHS Compliance |
Heat Sink |
Material :
Thermal Compound
|
Copper
Dow Corning TC-5021
Thermal Compound |
Skived fin |
Dimension:
Pitch:
Thickness of fin:
Number of fins :
Height of fin :
Height of base :
Length of base:
|
90 x 92 x 26.5 mm
1.5 mm
0.5 mm
46
20 mm
2.3 mm
92 mm |