Product/CPU COOLER/SC1U-OAK-B5
SC1U-OAK-B5
1U Intel P4 LGA775 socket T copper heat sink feature
w/skiving fins for better cooling and 2x cutting edge to avoid high component conflict.
| Specification | Application: Intel Socket T LGA775 Dimension: 92L x92W x27H(mm) Weight: 723g Thermal Resistance: 0.205 C/W |
| Heatsink | Fin Pitch: 1.5mm Skiving Fins Fin Thickness: 0.4mm Material: copper C1020 |
